Equipment Equipment Information Asset #
Ebara A30W Pump Details 1024F
Ebara A10S Pump Details 1025F
Ebara A10S Pump Details 1026F
EVG 850TB/200/150 Temporary Wafer Bonder Details 1027F
EVG 850TB/L200/150 Temporary Wafer Bonder (Parts Machine) Details 1028F
EVG 850DB/200 Wafer Bonder Details 1029F
EVG 850TB/L200/150 Temporary Wafer Bonder Details 1030F
ADE Ultragage 9500 Details 1031F
KLA-Tencor UV-1050 Prometrix Details 1032F
KLA-Tencor AIT Fusion XP Defect Inspection System Details 1033F
Synova LGS200A Laser Wafer Grinder Details 1034F
Synova LDS200A Laser Wafer Grinder Details 1035F
Leica INS-200 Inspection System Details 1036F
Leica Leitz ER60PLAN Light Microscope w/ Wafer Loader Details 1037F
Matech Waveetch 456G2 WetEtch Details 1038F
NadaTech T6 Wafer Sorter Details 1039F
NadaTech T6 Wafer Sorter Details 1040F
Rigaku XRF3630 Wafer Analyzer Details 1041F
Rudolph UFH200 Handler Details 1042F
Westech Avanti IPEC 472 CMP Polisher Details 1043F
Westech Avanti IPEC 472 CMP Polisher Details 1044F
TEL Trias TI/TiN-ALD MF CVD314-01 (4 Chamber) Details 1045F
TEL Trias Ti/TiN TEL MF CVD314-02 (4 Chamber) Details 1046F
Accretech/TSK PG200 Grinder w/ PG75 Slurry Details 1047F
Hitachi S-5200 FE-SEM Details 1049F

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