Equipment Equipment Information Asset #
Semicaps STM32 Sample Thickness Measurement Details 11527
SCP VIA Wet - SCP Details 11523
SCP Pilot Strip Hood/Manual Hood Details 11519
SCP Semi-automatic Batch Develop Hood Details 11515
SCP Plate CU Details 11512
ROFIN RSM IC-DR Details 11507
Hitachi CM-700 Die Bonder Details 11499
Rasco SO1000AH Handler Details 11497
PVA TePla 400 Plasma Details 11494
KLA-Tencor FT-750 Prometrix Details 11493
KLA-Tencor FT-650 Prometrix Details 11492
Rood Technology Proliner LeadStar 800 Details 11491
Applied Materials/AMAT Centura Rev.4 Poly/ WSix Details 1149
Polyflow DC50 Polyflow Details 11478
Philips/AMCC IC PEBEI Lasermark Details 11472
Applied Materials/AMAT Centura AP Etcher Details 1147
PAC SC200 Spin Coater Details 11469
PAC 150 Oxide Etcher/Asher Details 11466
Amicra SIS Semi-Automic Wafer Inking System Details 1146
Nutek NTM720-EM Details 11459
Nikon NSR-2005-i10C Stepper Details 11435
Nikon NSR-2005 i8A Stepper Details 11433
Nikon NSR-1505G4B Stepper Details 11428
Nikon NSR-1505 G4C Stepper Details 11423
Accretech/TSK ML200 Wafer Dicing Saw Details 1142

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