| Synova LDS200A Laser Wafer Grinder |
Details
|
1035F |
| Synova LGS200A Laser Wafer Grinder |
Details
|
1034F |
| KLA-Tencor AIT Fusion XP Defect Inspection System |
Details
|
1033F |
| KLA-Tencor UV-1050 Prometrix |
Details
|
1032F |
| ADE Ultragage 9500 |
Details
|
1031F |
| EVG 850TB/L200/150 Temporary Wafer Bonder |
Details
|
1030F |
| EVG 850DB/200 Wafer Bonder |
Details
|
1029F |
| EVG 850TB/L200/150 Temporary Wafer Bonder (Parts Machine) |
Details
|
1028F |
| EVG 850TB/200/150 Temporary Wafer Bonder |
Details
|
1027F |
| Ebara A10S Pump |
Details
|
1026F |
| Ebara A10S Pump |
Details
|
1025F |
| Ebara A30W Pump |
Details
|
1024F |
| Ebara A30W Pump |
Details
|
1023F |
| Ebara A30W Pump |
Details
|
1022F |
| AMAT Enabler Dielectric Etch Chamber (Ch # 414353 D) |
Details
|
1021F |
| AMAT eMax CT+ Dielectric Etch Chamber (Ch # 402240 A) |
Details
|
1020F |
| AMAT Axiom HT+ Strip Chamber (Ch # 414353 B) |
Details
|
1019F |
| AMAT eMax CT+ Dielectric Etch Chamber (Ch # 402248 C) |
Details
|
1018F |
| AMAT Enabler Dielectric Etch Chamber (Ch # 402248 B) |
Details
|
1017F |
| AMAT eMax CT+ Dielectric Etch Chamber (Ch # 402248 A) |
Details
|
1016F |
| Applied Materials/AMAT Centura Rev. 4 Hart 4 Chamber Complete System |
Details
|
1015F |
| Asyst Technologies PCB (PN: 3200-1230-01) |
Details
|
10-1566 |
| Applied Materials/AMAT Compass Pro 200 Inspection System |
Details
|
1014F |
| Alcatel Adixen AMS200SE Etcher |
Details
|
1013F |
| Leica INS-3300 Inspection Station (Model SW 7.0.0.1150-F2) |
Details
|
1012F |
